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Comparative study of oxide and non-oxide additives in …

2016-9-20 · Comparative study of oxide and non-oxide additives in high thermal conductive and high strength Si 3N 4 ceramics Hyun Min Leea, Eun Bok Leeb, Dong Lae Ki, Do Kyung Kima,n a Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon, 34141 Republic of Korea b Advanced Materials R&D …

A Tough Silicon Nitride Ceramic with High Thermal …

A silicon nitride ceramic is prepared by a modified sintering of reaction bonded silicon nitride method (SRBSN). This ceramic has a very high thermal conductivity, high fracture toughness, and a high strength. It is expected to be used as the next-generation insulating substrate material for high-power electronic devices and other new appliions.

Developing a High Thermal Conductivity Fuel with Silicon

2015-7-7 · “Developing a High Thermal Conductivity Fuel with Silicon Carbide Additives.” NEUP contract nuer 09-45600089174 ,University of Florida Ronald H. Baney PI, James S. Tulenko co-PI Sunghwan Yeo, Graduate Assistant 1. Abstract Enhanced thermal conductivity oxide fuels offer increases in both safety and efficiency of commercial light water

On the thermal conductivity of Cu–Zr_diamond composites

2017-10-20 · High thermal conductivity of 300–900 W/m K for Cu/Dia composites, by incorporation of 40–90 vol.% diamond particles can be obtained by several fabriion routes

High Thermal Conductivity Materials | MRS Bulletin

2011-1-1 · Every university student becomes familiar with the concept of thermal conductivity, a fundamental physical property of materials, through his or her textbooks. Initial work on high thermal conductivity was carried out in 1911 by Eucken, who discovered that diamond was a reasonably good conductor for heat at room temperature.

High thermal conductivity of spark plasma sintered …

High‐resolution transmission electron microscopy revealed two different SiC‐SiC boundaries, that is, amorphous and clean boundaries, in addition to a fully crystallized junction phase. A high thermal conductivity was attributed to a low lattice oxygen content and the presence of clean SiC‐SiC boundaries.

Thermal conductivity and dielectric constant of spark

The microstructure, thermal conductivity and dielectric constant of SPS AlN samples are examined. Results show that SPS can fabrie samples with superior thermal properties. Addition of 1 wt.% CaF 2 was found to have expedited the sintering process and this yielded thermal conductivity of …

Microstructure and thermal conductivity of spark plasma

2018-6-17 · Keywords: Aluminium nitride, Sintering additives, Spark plasma sintering, Thermal conductivity Introduction Aluminium nitride (AlN) is considered to be a promising material for microelectronic packaging because of its high thermal conductivity (320 W m21 K21 for the pure single crystal and 30– 270 W m21 K21 for sintered polycrystalline), low

Thermoelectric properties of spark-plasma sintered

Nanoparticular FeSb2 was prepared in solution from cyclopentadienyl iron(ii) dicarbonyl dimer [Fe(Cp(CO)2)]2 and antimony nanoparticles. Spark plasma sintering was used as consolidation method to maintain the particle size. The thermoelectric performance of FeSb2 is limited by its high thermal conductivity.

Microstructure tailoring of high thermal conductive

High thermal conductive β-silicon nitride (β-Si 3 N 4) ceramics were fabried from fine α-Si 3 N 4 powder as the raw material and coarse β-Si 3 N 4 particles as the nuclei through spark plasma sintering (SPS) at 1650 °C for 5 min and post-sintering heat treatment at 1900 °C for 4 h. The microstructures of the sintered β-Si 3 N 4 ceramics could be tailored with the nuclei.

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